Technology and Innovation News Updates

Microbots with modified design can move in water and air

Wednesday, November 1 2017

Microbots with modified design can move in water and air

Microbots with modified design can move in water and air Microbots with modified design can move in water and air November 1, 2017 56 The first microrobot has been introduced, is an aerial to aquatic robot known as RoboBee. It can fly, dive, swim and leap out of the water, and it’s totally adorable to boot. “RoboBee” is an aerial-to-aquatic robot that weighs just six-thousandths of an ounce (175 milligrams). These bots were first reported in 2014 in the journal Bioinspiration and Biomimetics, when — after 12 years of trying — Harvard roboticists finally got the tiny, fly-inspired devices to flutter. Since then, they’ve been adding functions. Now, they’ve made a robot that can swim and fly. “This is the first microrobot capable of repeatedly moving in and through complex environments,” Yufeng Chen, who co-authored a paper describing the new technology while a graduate student at Harvard University. “We designed new mechanisms that allow the vehicle to directly transition from water to air, something that is beyond what nature can achieve in the insect world.” The challenge of making this transition had to do with the viscosity of water versus air. RoboBee needed to be able to alter its wing-flapping rate so that it could flutter much faster in air than in water. (If the wings tried to flutter as fast in water as they needed for flight, they’d break off due to the greater viscosity of water.) The wing size also had to be appropriate for both mediums. The researchers ended up developing a bot that can switch from flapping at a frequency of about 300 hertz in the air to only around 13 hertz in the water. The bee robot also needed to be able to get out of the water again. This proved tricky because the surface tension of the water — the forces that hold water molecules to each other — easily overwhelmed the tiny robot, which is about the size of a paperclip. To power it through, the researchers added four outrigger floats, which kept the robot buoyant at the surface. They also equipped it with a central electrolyte plate that can convert water into oxyhydrogen. This oxyhydrogen acts as a fuel that blasts the bot out of the water onto the nearest solid surface. “By modifying the vehicle design, we are now able to lift more than three times the payload of the previous RoboBee,” Chen said. The RoboBee can’t fly immediately after leaving the water because it lacks onboard sensors that tell it what medium it’s in and doesn’t yet have sufficient motion-tracking for the fast feedback needed for self-control. The team plans to add these features in future iterations. “We hope that our work investigating tradeoffs like weight and surface tension can inspire future multi-functional microrobots — ones that can move on complex terrains and perform a variety of tasks,” Chen said. The robots can also elucidate the physics of the very small, said Robert Wood, the senior author of the new paper and an engineer at Harvard University. “While flying, the robot feels as if it is treading water; while swimming, it feels like it is surrounded by molasses,” Wood said in a statement. “The force from surface tension feels like an impenetrable wall. These small robots give us the opportunity to explore these non-intuitive phenomena in a very rich way.” TAGS

China Is Shifting From The Semiconductor Race, But Heading Where

Wednesday, November 1 2017

China Is Shifting From The Semiconductor Race, But Heading Where

China Is Shifting From The Semiconductor Race, But Heading Where China Is Shifting From The Semiconductor Race, But Heading Where November 1, 2017 49 China’s seems to be moderating its ambitions to become a global semiconductor power because it can’t out-spend the likes of Intel Corp. in the short run, but it still intends to become a force in unclaimed fields such as the Internet of Things . The country’s “corner-overtaking” strategy simply isn’t realistic, said Ding Wenwu, president of a $20 billion government-backed fund set up in 2014 to help lift the domestic chip sector out of obscurity. Ding, speaking at an industry forum, was using a racing term that refers to passing opponents at their most vulnerable. China is trying to reduce a reliance on some $200 billion of annual semiconductor imports, which it fears undermines both national security and the development of a thriving technology sector. Overall, Beijing envisions spending about $150 billion over 10 years to achieve a leading position in design and manufacturing, an ambitious plan that U.S. executives and officials warn could harm American interests. Ding’s China Integrated Circuit Industry Investment Fund Co. plays a key role by steering overall investment and strategy. “It’s very unrealistic to overtake on the corner given the current situation,” Ding told his audience in Shanghai. “It’s only possible when everyone is on the same starting line.” Money can’t solve the problem either, he said. Intel, Samsung Electronics Co. and Taiwan Semiconductor Manufacturing Co. alone wield annual research budgets in the billions or even tens of billions of dollars. “How can one overtake the front-runners when lagging so far behind? Not to mention the leaders are trying very hard to keep their position,” he said. Executives, academics and government officials converged on Shanghai this week to debate the future of their industry, convening one of the largest annual convocations of its kind. China’s import dependency and the Internet of Things dominated the agenda. The Ministry of Industry and Information Technology, the governing body for China’s tech and telecoms sector, focused on smart devices and chip-laden sensors as well as automobiles, considered a fertile market as cars increasingly become connected and autonomous. “We support innovations in areas such as smart devices, sensors, inter-connected smart vehicles and medical segments,” Diao Shijing, director of the electronics bureau under the ministry, told the forum. “The integrated circuits industry, as the fundamental and most important sector, has been searching for directions so it won’t miss new growth opportunities.” Leading China’s charge into the next generation of microchips is Unigroup, an affiliate of the business arm of elite Tsinghua University that’s become the largest player in a local market dependent on foreign high-performance processors and 3D-NAND memory chips. Unigroup and other Tsinghua affiliates have pulled off a number of acquisitions over the years in pursuit of capacity and technology: Unigroup bought RDA Microelectronics Inc. and Spreadtrum Communications Inc. to beef up its design capability and signed partnership deals with global players including Western Digital Corp. The company’s major business units and affiliates include integrated-circuit developer Unigroup Guoxin Co., formed via a series of mergers of state-backed entities. And its $2.8-billion Changjiang Storage was the result of a merger between Unigroup’s own memory chip operations and a government-run factory in 2016. But that M&A spree has hit a wall of late. Tsinghua was forced to withdraw a planned investment in Western Digital after the deal threatened to invite U.S. government scrutiny, while a Taiwanese acquisition attempt fell through. Now, China itself is discouraging unfettered overseas acquisitions, worried about capital outflow. That further threatens to stifle one avenue through which the country can swiftly acquire technological cred. “The overseas acquisition environment is now complicated,” Ding said without elaborating. TAGS

USB smart hub ICs enable smartphone-connected automotive Infotainment

Wednesday, November 1 2017

USB smart hub ICs enable smartphone-connected automotive Infotainment

USB smart hub ICs enable smartphone-connected automotive Infotainment USB smart hub ICs enable smartphone-connected automotive Infotainment New devices from Microchip provide unparalleled flexibility to fit customers’ designs November 1, 2017 46 With the rise in in-vehicle infotainment systems, car manufacturers need to provide a reliable, intelligent connection between the car’s display and one or more smartphones or tablets. Microchip Technology Inc., the industry leader in supplying the integrated circuits (ICs) that enable these connections, provides unrivaled options with its five new USB 2.0 smart hub ICs. These devices, available in a variety of architectures, offer greatly increased flexibility to fit car manufacturers’ design needs and meet consumer demand for easy-to-use, intuitive systems. The five new devices enable multiple architectures so manufacturers can implement their design of choice to easily interface with all major smartphone operating systems. These systems allow the graphical user interface of the phone or tablet to be displayed on the vehicle’s screen and enable integration with voice commands inside the car, all while simultaneously charging the mobile devices. They also enable driver assistance applications on mobile handsets to be integrated with an automobile’s infotainment system. Microchip’s new smart hub ICs enable cascading of the hubs to the second- and third-row seats with simultaneous data and charging in all ports. For example, if there are dual USB ports, one port can connect the phone or tablet to the head unit, leaving the other port free to charge and upload/download data. With Microchip’s new USB4914, USB4916, USB4925, and USB4927 smart hub ICs, car makers can customise solutions to meet their design needs. As the car becomes more of an entertainment environment, manufacturers can create solutions that allow consumers, for example, to use one phone for navigation and another for music or video. “Microchip is the leader in USB hub ICs for the automotive industry,” says Mitch Obolsky, vice president of Microchip’s USB and Networking Group. “Our long-term investment delivers patented technology that provides unique host/device bus configurations for handset connectivity into vehicles to allow better access to information and safer driver assistance and communication.” Microchip’s new USB4715, USB4914, USB4916, USB4925 and USB4927 USB 2.0 smart hub ICs provide unique USB configurations including single- and dual-bus implementations for optimal connection to infotainment systems. All devices operate with standard USB drivers present in most automotive head units for faster development, system validation and field updates. Each device also contains an integrated 32-bit microcontroller for advanced bridging, audio application support and USB Power Delivery (USB PD). Development Support A demonstration application board and evaluation board are available for each of the new USB 2.0 smart hub ICs. The demonstration application board emulates a system that a tier one supplier or Original Equipment Manufacturer (OEM) would use in their actual application. Microchip also provides a USB Power Delivery application showing charging for the USB PD 3.0 specification. Availability The USB4715, USB4914 and USB4925 are offered in a 48-pin QFN package. The USB4916 and USB4927 come in a 64-pin QFN package. Devices are available today in volume production in 10,000 unit quantities. For more information visit: www.microchip.com/USB4914

Automated Machine Learning Drives Intelligent Business

Wednesday, November 1 2017

Automated Machine Learning Drives Intelligent Business

Automated Machine Learning Drives Intelligent Business Automated Machine Learning Drives Intelligent Business By Jen Underwood, Founder, Impact Analytix, LLC November 1, 2017 54 Staggering predictions were shared at the 2017 Gartner Symposium earlier this month. By 2021 Gartner predicts, Artificial Intelligence Augmentation will generate $2.9 trillion in business value and recover 6.2 billion hours of worker productivity. It is no wonder why companies are moving swiftly to embrace these emerging technologies to assist people and attain a competitive advantage. Automated machine learning represents a truly transformational opportunity. Next generation business solutions powered by automated machine learning are an agent of change. Automated machine learning helps organizations better serve customers, improve business processes, solve complex problems and optimize outcomes when and where decisions are made. The goal isn’t necessarily to replace humans – it is to help them. Decrypting the black box Human resistance to change and decision automation is reasonable and rife. To ease fears and skepticism, start small with a well-known decision process that is not overly complex. Let the machine generate predictions and task humans with comparing actual results. In addition to validating predictions, delve into how the machine makes predictions. Deciphering the secret sauce of black-box machine learning used to be challenging if it was at all possible. That problem is beginning to abate. Modern machine learning solutions today are becoming more transparent due to increased legislation such as the General Data Protection Regulation (GDPR). Innovations in this space include visibility into predictive model designs, data transformation steps, applied algorithms and triggered prediction data values. Revealing how machines make automated decisions fosters human trust and adoption. Automated decision rules do not operate in isolation. Even though solutions such as DataRobot, H2O.ai Driverless AI, Tellmeplus, or open source auto-sklearn toolkit are simplifying the machine learning process with automation, humans are still essential. Machine learning, even when automated, still requires human evaluation, tuning, and monitoring. As these solutions interact with subject matter experts, the beauty of the human mind is combined with the amazing power of automated artificial intelligence. Designing multi-layer intelligence According to ‘Internet of Things’ (IoT) subject matter expert John Soldatos, “Achieving optimal results when designing an intelligent business is not only a matter of deploying automated machine learning, it also requires understanding multi-layer intelligence.” Typically, organizations deploy automated machine learning technologies at one or more layers in the field, on the edge or in the cloud. Field intelligence is used with smart machines, smart wearables and industrial robots where intelligent functions are embedded directly on field devices. With this approach, field devices become smart objects. Automated field-enabled decision processing saves bandwidth and can continue working regardless of network connectivity to enable real-time operations based on previous learning. Despite these benefits, field intelligence can be problematic due to the need to deploy complex data processing in CPU-constrained devices. Edge intelligence describes artificial intelligence functionality that is installed on an edge server that controls one or more field devices. It is suitable for use cases involving fast or close to the field processing, involving multiple devices. Edge intelligence uses data from both smart objects and other passive or semi-passive devices such as sensors, and RFID tags but also from edge computers (such as routers). As a result, edge processing can still discover intelligence patterns in (near) real-time at a low latency and without any essential loss of bandwidth. Cloud intelligence processing takes place in the cloud. It is ideal for the computing of massive datasets. Cloud intelligence typically uses data streams collected from multiple devices and edge servers, enterprise applications, supply chain management systems and other data sources. This level of automated machine learning configuration is commonly used for enterprise operations or industrial plant level management. The best predictive models have little to no organizational value unless they are rapidly operationalized within the business. Deciding optimal placement of deployed automated machine learning functions across the layers of digital business architecture is a key success factor. The good news is that automated intelligence can take place at any layer or multiple layers depending on the timing, latency, bandwidth and processing constraints. Modern automated machine learning tools continue to simplify deployment across all layers. TAGS

This Honeycomb Material Could Power A Leap in Quantum Technology

Wednesday, November 1 2017

This Honeycomb Material Could Power A Leap in Quantum Technology

This Honeycomb Material Could Power A Leap in Quantum Technology This Honeycomb Material Could Power A Leap in Quantum Technology A compound called hexagonal boron nitride can be made in super-thin sheets and emit single photons without fancy refrigeration. Michael Lucy reports. November 1, 2017 61 The quantum revolution that is poised to transform computing and communications is all worked out, in theory. The practicalities, however, are proving stubborn: manipulating matter and energy at the incredibly small scales required is no easy feat and often requires exotic materials and temperatures near absolute zero. A compound called hexagonal boron nitride (hBN) may save the day. According to a pair of Australian physicists writing in Science, it is about to make many quantum dreams a reality. The material has a honeycomb crystalline structure, like graphite, and can be created in thin sheets comprising just a single layer of atoms. What’s more, it can be made to emit single photons on demand without any fancy refrigeration. That property was discovered in 2016, by a team of researchers at the University of Technology Sydney in Australia. The two authors of this new Science article, Igor Aharonovich and Milos Toth, were part of that team. Many proposed quantum devices – computers, communicators, and sensors – rely on having a reliable and easy way to manipulate single photons. A contraption that can do this (a so-called single-photon emitter, or SPE) could form the building block of integrated circuits, or use quantum effects for secure communication, or even – closer to home, though of less scientific interest – power televisions and displays with more vivid and realistic colour. There have been two main ideas for how to build SPEs. The first is quantum dots, which are tiny particles that can be engineered to emit photons of a given frequency on demand. While these are an area of very active research, at present most only function at extremely cold temperature. The second is “colour centres”, which are tiny impurities in solid materials such as diamond that can emit or trap photons of a specific frequency (or colour). The studies of these took off in 2015 with the creation of two-dimensional colour centre SPEs. The atomic thinness allows easy transmission and absorption of photons, but these again only worked at very low temperatures. Enter hBN, which does away with the need for cryogenics and opens the way to much wider use of the technology. “Scientific applications are here already,” says Aharonovich. “It’s so far the brightest single photon source. Many people use it for calibration of their setups, and confocal microscope alignment.” Commercial applications may only be 3–5 years away, he adds, if everything “works as we think it should”. Even so, it won’t all be plain sailing. Making single-layer hBN itself in any large quantity “will require dramatic advances in fabrication methods”. TAGS

Graphene Enables High-Speed Electronics on Flexible Materials

Wednesday, November 1 2017

Graphene Enables High-Speed Electronics on Flexible Materials

Graphene Enables High-Speed Electronics on Flexible Materials Graphene Enables High-Speed Electronics on Flexible Materials Graphene enables high-speed electronics on flexible materials November 1, 2017 56 A flexible detector for terahertz frequencies (1000 gigahertz) has been developed by Chalmers researchers using graphene transistors on plastic substrates. It is the first of its kind and can extend the use of terahertz technology to applications that will require flexible electronics, such as wireless sensor networks and wearable technology . The results are published in the scientific journal Applied Physics Letters. Terahertz radiation has a wide range of uses and can occur in everything from radio astronomy to medicine. The term refers to the electromagnetic waves whose frequencies range from 100 gigahertz to 10 terahertz. Demand for higher bandwidth in wireless communications and depiction for security applications has led to intensified research on systems and components intended for terahertz frequencies. One challenge has long been to enable low weight and cheap applications. However, advances in polymer technology have promoted the development of flexible electronics and enabled the production of high-frequency units on flexible substrates. Now, Chalmers researchers Xinxin Yang, Andrei Vorobiev, Andrey Generalov, Michael A. Andersson and Jan Stake have developed the first mechanically flexible and graphene-based terahertz detector in its kind. Thus, paving the way for flexible terahertz electronics. The detector has unique features. At room temperature, it detects signals in the frequency range 330 to 500 gigahertz. It is translucent and flexible and opens to a variety of applications. The technique can be used for imaging in the terahertz area (THz camera), but also for identifying different substances (sensor). It may also be of potential benefit in health care, where terahertz waves can be used to detect cancer. Other areas where the detector could be used are imaging sensors for vehicles or for wireless communications. The unique electronic features of graphene, combined with its flexible nature, make it a promising material to integrate into plastic and fabric, something that will be important building blocks in a future interconnected world. Graphene electronics enables new applications for, among other things, everyday objects, which are commonly referred to as the Internet of Things. The detector shows the concrete possibilities of graphene, a material that conducts electric current extremely well. It is a feature that makes graphene an attractive building block in fast electronics. The Chalmers researchers’ work is, therefore, an important step forward for graphene in the terahertz area, and a breakthrough for high performance and cheap flexible terahertz technology. The detector drew attention at the EU Tallinn Digital Summit recently, where several important technological innovations made possible by graphene and related materials were on display. At the summit, EU Heads of State and Government gathered to discuss digital innovation and Europe’s digital future. The flagship focus was to show what role graphene can play. TAGS

ST’s STM32H7 Series MCU Boost Protection for Connected, Smart Devices

Wednesday, November 1 2017

ST’s STM32H7 Series MCU Boost Protection for Connected, Smart Devices

ST’s STM32H7 Series MCU Boost Protection for Connected, Smart Devices ST’s STM32H7 Series MCU Boost Protection for Connected, Smart Devices November 1, 2017 70 Platform Security Architecture (PSA) from Arm enhances support for cost-effective state-of-the-art security in the IoT world ST’s Arm Cortex-M7 based STM32H7 series MCUs combine PSA principles with advanced security features and services STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications and a leading supplier of Arm-based microcontrollers (MCU) used in Internet-of-Things (IoT) devices, welcomes Platform Security Architecture (PSA) from Arm, announced on November 01, 2017, as a major enabler for ubiquitous, best-in-class cyber security. ST’s STM32H7 high-performing MCUs are designed with the same security concepts as the PSA framework and combine these principles with STM32-family enhanced security features and services. People and organizations are increasingly dependent on connected electronic devices to manage time, monitor health, handle social interactions, consume or deliver services, maximize productivity, and many other activities. Preventing unauthorized interactions with these devices is essential to protecting identity, personal information, physical assets, and intellectual property. As the IoT grows in scope and pervasiveness, public safety and national security are also at stake. As device manufacturers must always innovate to beat new and inventive hacking exploits, PSA helps them implement state-of-the-art security cost-effectively in small, resource-constrained devices. “ Security is a major priority to ensure the success of the IoT. Winning the confidence of end users — from individual consumers to businesses and government agencies – is critical to adoption, ” said Michel Buffa, Microcontroller Division General Manager, STMicroelectronics. “ PSA from Arm is making core security capabilities like device identity and over-the-air (OTA) updates more affordable and scalable for small autonomous IoT devices, and we’ve made it work with the existing security features of STM32 microcontrollers, including on our high-performing STM32H7 series .” ST’s STM32H7 MCU devices integrate hardware-based security features including a True Random-Number Generator (TRNG) and advanced cryptographic processor, which will simplify protecting embedded applications and global IoT systems against attacks like eavesdropping, spoofing, or man-in-the-middle interception. In addition, secure firmware loading facilities help OEMs ensure their products can be programmed safely and securely, even off-site at a contract manufacturer or programming house. To enable secure loading, security keys and software services already on-board the MCU permit OEMs to provide manufacturing partners with already-encrypted firmware, making intercepting, copying, or tampering with the code impossible. This enables programming and authenticating the device to establish the root-of-trust mechanism needed for the device to be connected to the end-user’s network and remotely updated over the air (OTA) to apply security patches or feature upgrades throughout the lifetime of the device. “ Arm is working with our ecosystem to shift the economics of security with the introduction of PSA as a common industry framework for securing the next trillion connected devices ,” said Paul Williamson, vice president, and general manager, IoT Device IP, Arm. “ The secure hardware blocks and firmware-loading services ST has embedded in the Cortex-M based STM32H7 series utilizes the Arm PSA principles to drive innovation in security for a broad range of applications, including communication gateways and connected objects .” TAGS

Transparent Solar Technology Represents Wave of the Future

Wednesday, November 1 2017

Transparent Solar Technology Represents Wave of the Future

Transparent Solar Technology Represents Wave of the Future Transparent Solar Technology Represents Wave of the Future November 1, 2017 48 See-through solar materials that can be applied to windows represent a massive source of untapped energy and could harvest as much power as bigger, bulkier rooftop solar units, scientists from Michigan State University report in Nature Energy. Led by engineering researchers at Michigan State University, the authors argue that widespread use of such highly transparent solar applications, together with the rooftop units, could nearly meet U.S. electricity demand and drastically reduce the use of fossil fuels. “Highly transparent solar cells represent the wave of the future for new solar applications,” said Richard Lunt, the Johansen Crosby Endowed Associate Professor of Chemical Engineering and Materials Science at MSU. “We analyzed their potential and show that by harvesting only invisible light, these devices can provide a similar electricity-generation potential as rooftop solar while providing additional functionality to enhance the efficiency of buildings, automobiles, and mobile electronics.” Lunt and colleagues at MSU pioneered the development of a transparent luminescent solar concentrator that when placed over a window creates solar energy without disrupting the view. The thin, plastic-like material can be used on buildings, car windows, cell phones or other devices with a clear surface. The solar harvesting system uses organic molecules developed by Lunt and his team to absorb invisible wavelengths of sunlight. The researchers can “tune” these materials to pick up just the ultraviolet and the near-infrared wavelengths that then convert this energy into electricity. Moving global energy consumption away from fossil fuels will require such innovative and cost-effective renewable energy technologies. Only about 1.5 percent of electricity demand in the United States and globally is produced by solar power. But in terms of overall electricity potential, the authors note that there are an estimated 5 billion to 7 billion square meters of the glass surface in the United States. And with that much glass to cover, transparent solar technologies have the potential of supplying some 40 percent of energy demand in the U.S. – about the same potential as rooftop solar units. “The complimentary deployment of both technologies,” Lunt said, “could get us close to 100 percent of our demand if we also improve energy storage.” Lunt said highly transparent solar applications are recording efficiencies above 5 percent, while traditional solar panels typically are about 15 percent to 18 percent efficient. Although transparent solar technologies will never be more efficient at converting solar energy to electricity than their opaque counterparts, they can get close and offer the potential to be applied to a lot more additional surface area, he said. Right now, transparent solar technologies are only at about a third of their realistic overall potential, Lunt added. “That is what we are working towards,” he said. “Traditional solar applications have been actively researched for over five decades, yet we have only been working on these highly transparent solar cells for about five years. Ultimately, this technology offers a promising route to inexpensive, widespread solar adoption on small and large surfaces that were previously inaccessible.” The work is funded by the National Science Foundation and the U.S. Department of Education. Lunt’s coauthors are Christopher Traverse, a doctoral student in engineering at MSU, and Richa Pandey and Miles Barr with Ubiquitous Energy Inc., a company Lunt cofounded with Barr to commercialize transparent solar technologies. TAGS

Mukesh Ambani: RIL chairman Mukesh Ambani becomes Asia's richest person | Gadgets Now

Thursday, November 2 2017

Mukesh Ambani: RIL chairman Mukesh Ambani becomes Asia's richest person | Gadgets Now

Reliance Industries Chairman Mukesh Ambani on Wednesday overtook China 's Hui Ka Yan to become Asia's richest person with a total wealth of $42.1 billion. According to Forbes' real time billionaire's list, Ambani's personal wealth rose by $466 million, thanks to 1.22 per cent rise in shares of Reliance Industries to Rs 952.30 on Wednesday. On the other hand, wealth of China Evergrande Group's Chairman Hui Ka Yan slumped by $1.28 billion to $40.6 billion on Wednesday. Globally, Ambani stood at the 14th spot on Forbes' real time billionaire's list, which is based on the value of person's stock holding and assets on a real time basis. Ambani has seen a huge jump in his personal wealth in 2017, as the shares of Reliance Industries have jumped over 75 per cent year-to-date. Last month, RIL had churned out another billion dollar profit in the September quarter thanks to robust growth in gross refining margins and petrochemical revenues. Consolidated net profit of the company had increased 12.48 per cent year-on-year (YoY) to Rs 8,109 crore for the quarter ended September 30, 2017 against Rs 7,209 crore in the corresponding quarter last year. RIL on Wednesday became the first Indian company to hit the market capitalisation of Rs 6 lakh crore. Ambani's telecom rival Sunil Mittal also saw a huge jump in personal wealth on Wednesday. Mittal's real time net worth according to Forbes surged by $751 million to $10.9 billion. Shares of Bharti Airtel , had surged by 8.19 per cent to Rs 538.40 on Wednesday. View As Photolist » Meet the 10 richest techies in India 1 11 Meet the 10 richest techies in India Forbes' India Rich List 2017 is out. The annual list of India's richest business tycoons estimates the net worth of India's 100 richest at $479 billion, a rise of 26% from $374 billion in 2016. The list has fair share of tech billionaires. Read on for the names. Mukesh Ambani Reliance Industries chairman Mukesh Ambani tops Forbes' India Rich List 2017. According to Forbes, Mukesh Ambani's net worth stands at $38 billion. Though per se not a 'tech billionaire', he makes it to this list courtesy Reliance Jio. The Reliance Industries' chairman is betting big on his group's foray into the telecom sector. Reliance Jio launched its services commercially in September last year. In July this year, the company announced a new feature phone called JioPhone. The JioPhone comes at a effective price tag of Rs zero. Buyers have to pay a security deposit of Rs 1,500, refundable after three years. Azim Premji Next on the list is Azim Premji. Premji is chairman of Bangalore-based Wipro, one of the country's largest software and IT services company. His net worth, according to Forbes, is $19 billion. The 72-year old Premji is ranked among Asia's most generous billionaires, having given away 39% of his company's shares. Shiv Nadar Next tech billionaire on the list is HCL Technologies' founder Shiv Nadar. He ranks at No. 7 in the overall list with a net worth of $13.6 billion. Nadar founded HCL in the year 1976. HCL Tech today employs over 120,000 people globally. He ranks at No. 18 among the richest people in the tech globally. Sunil Mittal Next from the tech industry on the Forbes' India Rich list is Bharti Airtel chairman Sunil Mittal at No. 14 (over all list ranking). His net worth, according to Forbes, is $8.3 billion. Airtel is the largest telecom service provider in India. The company is into a bruising tariff war with the newest telco, Reliance Jio. Earlier this year, the Bharti Airtel also launching Airtel Payments Bank in a joint venture with Kotak Mahindra Bank. Anil Ambani At No. 45 on the Forbes' India Rich List 2017 is Reliance Communications' Anil Ambani. According to Forbes, the net worth of the younger of the Ambani brothers is $3.15 billion. Anil Ambani's business empire also has interests in financial services, media and infrastructure. Reliance Communications recently called off its merger with Aircel. NR Narayana Murthy NR Narayana Murthy is the next tech billionaire in Forbes' India Rich List 2017. Infosys co-founder Murthy stepped down as chairman of the company in the year 2011, after almost 3 decades with the company. He returned to Infosys in 2013 and left in 2014 after handing over the CEO's position to former SAP exec Vishal Sikka. He was recently in news after Infosys board blamed him for the resignation of the former CEO Sikka. The resignation of Sikka led to a management shakeup in the company leading to the return of cofounder Nandan Nilekani as non-executive chairman. He is also ranked among the richest tech billionires in the world. Dinesh Nandwana One of the new entrants on Forbes' annual India Rich list is Dinesh Nandwana, the CEO and managing director of e-governance services firm Vakrangee Ltd. Ranked at No. 88 in the overall list, his netw worth is $1.72 billion. Nandan Nilekani Next on list is another Infosys co-founder, Nandan Nilekani. Nilekani is also the current non-executive chairman of the IT giant, a position he took over in August 2017 after a board shakeup. He is also the former chairman of Unique Identification Authority of India, the body responsible for creating identity card scheme Aadhar. Nilekani ranks at No. 89 in the Forbes' India Rich List 2017 with a net worth of $1.71 billion. He is the biggest investor in TeamIndus, the Indian company building a spacecraft to land on the moon. Senapathy Gopalakrishnan Third person to be on the list from Indian IT giant Infosys is Senapathy Kris Gopalakrishnan. One of the co-founders of Infosys, Gopalakrishnan retired from the company in the year 2014. With a net worth of $1.61 billion, he ranks at No. 92 on Forbes' India Rich List 2017. Since his retirement, Gopalakrishnan has invested in over 60 startups. Vijay Shekhar Sharma At No. 99 is another billionaire from the technology industry, Paytm's Vijay Shekhar Sharma. His net worth, as per Forbes' India Rich List 2017, is $1.47 billion. Founded in the year 2011, Paytm has been one of the biggest beneficiaries of Indian government's demonetisation. Sharma owns some 18% in Paytm, which was valued at $7 billion in May this year.

BLH Nobel Announces PROFINET Support, FM Approvals, and New Language Features

Thursday, November 2 2017

BLH Nobel Announces PROFINET Support, FM Approvals, and New Language Features

BLH Nobel Announces PROFINET Support, FM Approvals, and New Language Features BLH Nobel Announces PROFINET Support, FM Approvals, and New Language Features For Industry Best-Selling G5 Series Measurement Amplifiers November 2, 2017 55 The BLH Nobel brand of Vishay Precision Group, experts in standard and custom process weighing and force measurement solutions, including high-quality and high-accuracy weighing and control systems, on November 1, announced the addition of PROFINET support, Factory Mutual (FM) approvals, and French and German language accessibility for its industry best-selling G5 Series measurement amplifiers (G5 Series). The new PROFINET support module for the BLH Nobel G5 Series allows the modern, user-friendly measurement amplifiers the necessary flexibility to keep pace with the very latest Industrial Ethernet automation standards in Asia and Europe. The module may be plugged into the back of the G5, in the same manner as its Ethernet IP module. This next-generation PROFINET support further allows the end user to create seamless end-to-end, integrated processes and network interface configurations, with fast and secure data exchange. G5 Series measurement amplifiers offer continued ease of calibration and remote access with common field busses, with intuitive user-friendly setup via web browser or keyboard. For customers based in the United States and Canada, the addition of FM approvals provides added assurances that G5 Series measurement amplifiers meet only the highest standards for property loss prevention and safety. They further allow the G5 Series to be used within an increasing series of control and process industry applications where such approvals may be required. Additional full language support in French and German, including complete menus and software, join the existing English and Swedish versions. Short form manuals are available in all four languages. G5 Series measurement amplifiers from BLH Nobel combine standard interfaces, a modular design, and onboard integral web servers, in support of advanced weighing and process control applications. They offer streamlined commissioning and calibration; reduced operations and maintenance costs; and advanced communication protocols for optimized system efficiencies, including remote diagnostics, parameterization, backup and maintenance functions. A February 2017 firmware upgrade (v1.3.0) added new capabilities such as flow rate calculation, enhanced diagnostics, excitation current measurement and supervision, along with updated Fieldbus data mapping, and an EtherNet/IP interface. Panel mount versions of the G5 Series were further certified “legal for trade” in May 2017, per EN45501:2015 and the International Organization of Legal Metrology (OIML), for R76 Class III or IIII single-interval industrial use criteria (NTEP approvals pending). Other features may be available upon request.

MediaTek Joins Google to Deliver Certified Mobile Services to Device Makers

Thursday, November 2 2017

MediaTek Joins Google to Deliver Certified Mobile Services to Device Makers

MediaTek Joins Google to Deliver Certified Mobile Services to Device Makers MediaTek Joins Google to Deliver Certified Mobile Services to Device Makers MediaTek offers pre-certified and CTS-compliant Android builds with Google Mobile Services to ensure quality Android experiences & get devices to market faster November 2, 2017 67 MediaTek Inc. on November 2, 2017, announced that it is the first System-on-Chip (SoC) partner for GMS Express, a program designed to provide approved Android software solutions, including Google Mobile Services (GMS) and Google Compatibility Test Suite (CTS) certification, to device makers. As GMS Express’s first SoC partner, MediaTek can help device makers get to market more cost effectively and faster and ensure high-quality, consistent consumer experiences with Android applications and devices. Under the new program, MediaTek provides device makers with a pre-tested, pre-certified, and fully compliant build of Android and GMS. For the past several months, MediaTek has already worked with several of its customers in connection with GMS Express. In fact, dozens of brands have already joined the GMS Express program. “MediaTek is focused on making great technology available to everyone. This program supports the entire Android community and ensures that from the program’s OEM participants and their devices within the program, only pre-tested and certified Android builds appear in the marketplace to give consumers the confidence they have a secure, first-class Android experience,” said TL Lee, General Manager of MediaTek’s wireless business. “Being the first SoC company endorsed for GMS Express reinforces MediaTek as a full hardware and software solutions provider to help brands improve time to market and user experiences with Android devices.” MediaTek customers – Original Equipment Manufacturers (OEM’s) and Original Design Manufacturers (ODM’s) – can reduce the typical compatibility certification process from three months to four weeks. They also receive frequent security patches to reduce risks of device hacking. MediaTek’s support of GMS Express is seamless because of its smartphone design expertise and experience working with the large, global Android customer base. MediaTek chipsets power more than 1.5 billion devices a year across a broad range of products including smartphones, TVs, voice-assisted devices, routers and more. “Android has enabled a healthy ecosystem of diverse OEM manufacturers who deliver compelling devices at all price points throughout the world,” said Jim Kolotouros, VP, Global Android Partnerships at Google . “We are excited by MediaTek’s leadership in connection with the GMS Express program, and enabling the OEM ecosystem to develop high-quality devices more quickly, more cheaply, and more easily.” MediaTek, the first SoC provider to support Google’s GMS Express program, has been a market innovator since the company first entered the mobile market with a mission to improve time-to-market and mobile ecosystem efficiency. The GMS Express program is the latest example of MediaTek’s commitment to serving as a total pipeline solution provider, including SOC hardware, turnkey solutions, and certification support.

Market Research on 2D Electronics Market 2017 and Analysis to 2027

Thursday, November 2 2017

Market Research on 2D Electronics Market 2017 and Analysis to 2027

Market Research on 2D Electronics Market 2017 and Analysis to 2027 Market Research on 2D Electronics Market 2017 and Analysis to 2027 November 2, 2017 75 With the rapid advancements in technology , there is an improvement in electronics and photonics with the introduction of 2D electronics. 2D electronics are the advanced electronic devices made up by the integration of electronic devices with 2D materials. For example, the combination of 2D nanoparticles with electronic devices results into a more efficient, fast and a small unit. The resulting 2D electronics shows the advantages and benefits of both the electrical device and the 2D material with which the electronic device is combined. 2D electronics has optical, mechanical and electrical properties that enhance the performance of electronic devices. The research on 2D electronics is still under development and henceforth has the attention of many researchers as it promises a range of new technologies. Less energy consumption is also a benefit of 2D electronics over other applications that will create huge market opportunity. The size of 2D materials is equivalent to the thickness of only a few atoms, making it very small and effective material. The decreased size with a faster and higher functioning efficiency is a driver for the 2D electronics market. Various application offerings by the product, being in the development stage, has caught the attention of various researchers, resulting in an increased adoption of the devices. Graphene, for example, is one of the most active 2D material used for the manufacturing of 2D electronics as it has shown enhancements in electronic and photonic properties.The complexity in the structure of the 2D electronics makes the manufacturing of the products expensive limiting the growth of the 2D electronics Market, making it accessible to only a few. Global 2D electronics Market can be divided into the following segments – based on Product Type and based on applications . The major segments of 2D electronics market on basis of product type include: Electronic devices: Transistors, chemical sensors, biological sensors, environmental sensors etc. are some of the 2D electronic devices; Optoelectronic devices: Valleytronics, Photodetectors, laser and light emitting diodes etc. are some of the 2D optoelectronic devices 2D Electronics Market Segmentation – Security Display and Imaging, Biomolecular sensing, Energy harvesting, Optical communications, Electromechanical systems, Solar cells, Batteries, and ultracapacitors The 2D electronics market is sub-segmented into 7 key regions- North America, Latin America, East Europe, West Europe, Asia-Pacific excluding Japan, Japan, and Middle East & Africa. The 2D electronics market is in developing stage across all the regions and it majorly being adopted in North America to develop efficient 2D electronics devices in the market. The APAC region is expected have high potential as there is huge demand for 2D based technology to develop advanced consumer electronics products, MEA will be one of the fastest growing markets in 2D electronics market as increasing demand for 2D based electronics devices The hybrid technology to combine two or more 2D materials to produce one single material is the new key development in 2D electronics.The 2D electronics resulting from this integration functions on molecular level increasing the applications of the products showing enhanced features when compared with the parent 2D materials.Rice University (U.S.) has taken an initiation to combine a conductor and an insulator to produce 2D electronics device on an atomic level. The resulting product is made by the combination of graphene and hexagonal boron nitride.Some of the major 2D electronics global players are SANKO SEMICONDUCTOR Co., Ltd., Skeleton Technologies, Haydale Limited, Aledia, Graphene Laboratries Inc., 2D semiconductors, CIC nanoGUNE, and 2D Electronic and Automation.